200 & 300 mm batch/single OEM handling system

Transfer FOUP/FOSB compatible
25 to 25 wafers
Single wafer 300mm

200 & 300 mm batch/single OEM handling system

Comet 300mm OEM BHS allows the single or batch wafer transfer of 300mm wafers from one FOUP/FOSB to inspection position and back.
Fully designed for OEM integration the 300mm OEM BSH is dedicated to various inspection and measurement applications, such as:
Defect analysis
Surface analysis
Thickness measurement
Resistivity measurement
Transfer FOUP/FOSB compatible
25 to 25 wafers

Options

  • Ionization system
  • Fan filter unit
  • Bar code gun
  • Empty/cross/double slot mapping
  • Performance
  • Average loading/unloading time < 1mn

Performance

  • Fully automated FOUP/FOSB/FFO management
  • Optimized footprint
  • 1 or 2 load port
  • Operator touch screen
  • Easy for integration to any 300mm tool
  • IR/FR or barcode FOUP ID
  • Interface RJ45 or RS 232/TCP/IP
  • OHT/AGV/PGV load port
  • Tower light

Facilities and Requirements:

  • Weight: 650 kg
  • Power: 100-240 VAC
  • Frequency: 50-60 Hz
  • Full Load Amps: 5 A
  • No need for compressed air

Specifications:

  • CE certification
  • SEMI Standard
  • Class 1

Software flexibility

  • Standard or customizable software
  • Wafer recoveries
  • Restart after error
  • Option multiple
  • Friendly interface and customizable
  • Easy integration with other systems by SECII-GEM, ASCII, RS, TCPIP


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