ALIX V5 QUANTUM

Tempress Furnace Automation Key system features > 4,000 wfr/hr (load reload) Solid sheet metal frame Single wafer and back to back loading Standard pitch and half pitch loading Wafer thickness from 160 to 220 microns Configurable to various carrier types 4 cassettes buffer capacity   Customer benefits High stability, reliability & accuracy Excellent breakage rate, […]

200 & 300 mm batch/single OEM handling system

Transfer FOUP/FOSB compatible 25 to 25 wafers Single wafer 300mm Comet 300mm OEM BHS allows the single or batch wafer transfer of 300mm wafers from one FOUP/FOSB to inspection position and back. Fully designed for OEM integration the 300mm OEM BSH is dedicated to various inspection and measurement applications, such as: Defect analysis Surface analysis […]

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Solar & Semiconductor systems
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